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Online Store for Ordering
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TMT-9000S

The TMT-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material
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TMT-9000S Soldering System
File Size: 754 kb
File Type: pdf
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Thermaltronics M Series tips cross to both EasyBraid®  EBM series and Metcal®  STTC series soldering cartridges.  
Request Solder Tip Sample
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TMT-2000S

The TMT-2000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.
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TMT-2000S Soldering System
File Size: 724 kb
File Type: pdf
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The Thermaltronics Robotic System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs.
  •  Dual Arm, Six Axis Soldering Robot
  •  Intelligently compensates for PCBA variance
  •  Image Recognition & Mapping System
  •  Laser Height Measurement
  •  Uses Curie Heat Technology for precise temperature control
TMT-R9800S Soldering Robot
File Size: 2391 kb
File Type: pdf
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​TMT-R9800S FEATURES
  1. Unlike typical Cartesian robots the Thermaltronics TMT-R9800S Soldering Robot, is equipped with full vision (eyes) to verify the procedure being undertaken and does not simply follow a pre-determined program. The soldering robot has an observation mode, a verification mode and decision making capabilities (brain). This capability of collecting and utilizing data for production processing is one of the most important factors necessary to meet the requirements of Industry 4.0 standards. 
  2. Through the use of servo motors and precision ballscrews, the Thermaltronics Robot system is able to accurately meet the requirements of high speed operation, repeatability and durability. 
  3. Application programming is made simple by using full image-merging and mapping techniques. 
  4. Dynamic laser height measurement/adaptive control, ensures precision soldering repeatability. 
  5. A full vision mapping and matching system, provides for intelligent decision making during procedural operations
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